Industry Directory | Manufacturer
We have a consistent, proven and documented on-time history. Our core quick turn capability is utilized for development of prototypes and medium production runs, over a time horizon, which stretches from one day to several weeks.
New Equipment | Board Handling - Conveyors
Model No：KSUN350 Automatic 90 degrees Turning Machine Cycle time：Approx 15seconds Power supply：100-230V AC (customized), single phase Power load：Max 300V/A Air pressure： 4-6 bar Air volume：MAX 20L/minute Transport height：900±20mm (or customiz
New Equipment | Board Handling - Conveyors
product instruction ※ PLC control system, Working is stably and reliably ※ Enclosed design ensure the highest security level ※Balanced, stable, accurate rotation mode ※Easy to operate touch screen control interface ※ Smooth and parallel width ad
Electronics Forum | Wed Jan 16 10:52:19 EST 2008 | kbhatia
R SMT line flow to a R->L flow after the 90 degree turn. We have some equipment that is R->L and wish to interface to the end of this line. So the flow is oven (with enough air blowers that the 8040 is cool) -> 8040 turnstyle to move LEFT (technicall
Electronics Forum | Wed Dec 19 14:20:19 EST 2007 | slthomas
I'm inclined to suggest that you use a specified temperature, thus eliminating your situation. Why not use 90�C? I suppose you could calculate a duration for 70 based on the requirements at 40 and 90 if you really wanted to, but still I wonder why.
Used SMT Equipment | Conveyors
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Used SMT Equipment | Conveyors
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Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Industry News | 2021-09-02 06:10:22.0
MIRTEC announces the release of their comprehensive AI based Smart Factory Automation solution 'INTELLI-PRO'. This Technologically Advanced Software and Algorithm Package is specifically designed for the purpose of improving the performance and convenience of MIRTEC's complete line of AOI machines. INTELLI-PRO consists of a proprietary Deep Learning based Automatic Part Search and Teaching function, and AI based; Automatic Parameter Optimization, Character Recognition (OCR), Foreign Object Detection (FOD), Placement Inspection Algorithms and an Automatic Defect Type Classification function.
Parts & Supplies | Pick and Place/Feeders
Nozzle Changer 6, Turned 90 degrees, HF
Parts & Supplies | Pick and Place/Feeders
grease nipple M6 90 degree (pac=5pcs)
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
https://www.ascen.ltd PCB rotation conveyor PCB turn conveyor|180 degree or 90 degree turning rotational transport change PCB side direction output reflow oven for processing.auto PCB turn conveyor and PCB diverter changing the PCB conveying direct
https://www.ascen.ltd PCB rotation conveyor PCB turn conveyor|180 degree or 90 degree turning rotational transport change PCB side direction output reflow oven for processing.auto PCB turn conveyor and PCB diverter changing the PCB conveying direct
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | Marietta, GA 30066, Georgia USA | Engineering
Test Engineer BSEE or equivalent degree required. Ten years experience desirable with background in functional development, as well as ICT, in a production atmosphere. Primary functions will be to: (a)develop functional tests and test procedures (
Career Center | , California USA | Engineering
This opportunity is with a top tier, leading provider of turnkey Electronics Manufacturing Service solutions to OEMs in the fast-growth telecommunications industry. This San Francisco Bay Area company�s net sales grew by 90% in the last year. As you
Career Center | Gurgaon, Haryana India | Management
� Heading daily morning meeting with all program managers, materials manager, test engineering manager, process engineering manager, quality control manager, planning manager, stock room manager, shipping department head. Discussion about incoming or
Career Center | Bangalore, Karnataka India | Sales/Marketing
Dear Mam / Sir, Greetings, My 22 years of Sales & Business Development experience in “Capital Equipments” (Plastic processing m/c's, Turn-key packaging m/c’s, etc.) should be of interest to a fast growing company like yours. My experience in vario
